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HDF-R26-113L012

Name: NorComp HDF-R26-113L012
Brand: NorComp
SKU: 636-HDF-R26-113L012
Price: 12342 CRC
Availability: OutOfStock

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Mouser N.º:

636-HDF-R26-113L012

Fabricante N.º:

HDF-R26-113L012

Fabricante:

NorComp

Descripción:

Conectores de alta densidad subminiatura D 26 pin R/A solder M 30u 4-40 int thrd

Hoja de datos:

HDF-R26-113L012 Hoja de datos (PDF)

Modelo ECAD:

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Disponibilidad

Existencias:: No en existencias

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Plazo de entrega de fábrica:: Solicitar cotización de entrega

Introducir cantidad:

Mínimo: 54 Múltiples: 54

Precio unitario:

₡-

Precio ext.:

₡-

Est. Tarifa:

Precio (CRC)

Cantidad	Precio unitario	Precio ext.
	₡12 342	₡666 468
	₡12 337	₡1 332 396
	₡12 081	₡3 261 870
	₡11 983	₡6 470 820
2 538	Presupuesto

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Atributo del producto	Valor de atributo	Seleccionar atributo
Fabricante:	NorComp
Categoría de producto:	Conectores de alta densidad subminiatura D
RoHS:
REACH - SVHC:
Número de posiciones:	26 Position
Número de filas:	3 Row
Género:	Male
Estilo de terminación:	Solder Tail
Ángulo de montaje:	Right Angle
Revestimiento del contacto:	Gold
Régimen de corriente:	3 A
Serie:	HDF
Clasificación IP:	IP67
Empaquetado:	Tray
Marca:	NorComp
Material del contacto:	Brass
País de ensamblaje:	Not Available
País de difusión:	Not Available
País de origen:	TW
Filtrado:	Unfiltered
Aislamiento:	Insulated
Material de aislamiento:	Polybutylene Terephthalate (PBT)
Temperatura de trabajo máxima:	+ 85 C
Temperatura de trabajo mínima:	- 25 C
Estilo de montaje:	Panel
Tipo de producto:	High Density D-Sub Connectors
Material de la cubierta:	Steel
Revestimiento de la carcasa:	Tin
Cantidad de empaque de fábrica:	54
Subcategoría:	D-Sub Connectors
Nombre comercial:	NANOOK

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Atributos seleccionados: 0

Filtrar documento:

USHTS:: 8536694040
ECCN:: EAR99

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