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Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.30/5/2024 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.27/5/2024 -
Bergquist Company Aplicaciones de centros de datosMateriales avanzados que contribuyen a la gestión térmica, la confiabilidad a largo plazo y la protección contra el estrés.1/4/2023 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.11/7/2022 -
Bergquist Company EV Charging SolutionsDesigned to provide safe charging while protecting EV battery packs from thermal/electrical events.13/4/2022

